In this webinar, you will learn:
- The flexible hybrid electronics (FHE) process to convert the rigid Arduino board to its flexible counterpart
- How the results measured up against a regular Arduino
- The process steps required
- How the form factor changes
- How a standard copper flex process was modified to a new additive FHE approach
- Experience, insights and Q&A from the audience
Wilfried Bair
Senior Engineering Manager - Device Integration & Packaging
NextFlex
Wilfried Bair is responsible for device integration and system level hardware projects for NextFlex. Prior to joining NextFlex, Wilfried was VP of Business Development for Tango Systems where he developed strategic partnerships and led them to enter the two fastest growing semiconductor packaging market segments, establishing them as a market leader. Previously, as VP of Strategic Business Development for SUSS Microtec AG, Wilfried provided leadership to business units, identifying disruptive technology gaps, new marketing opportunities and acquisition targets. Other positions held at SUSS were GM, North American Operations, and Division Manager of Wafer Bonders. Wilfried’s technical expertise spans leading edge packaging processes, next generation solar and energy storage, semiconductor equipment and process, and device expertise for automotive, consumer and medical applications.
