GDSI Reveals a New Dicing Process

A MSIG Webinar Series on MEMS Foundry, Dicing & Fabrication

Now available to watch on-demand.

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

Abstract

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology.

Thank you for your interest

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